Applied Materials (AMAT) announced plans to expand its global EPIC innovation platform with a new collaboration model specifically designed to accelerate commercialization of advanced chip packaging technologies. To kick-off the initiative, Applied convened more than two dozen top R&D leaders from the semiconductor industry to encourage alliances between equipment makers, material providers, device companies and research institutes. The goal is to fast-track new technologies for the next generation of energy-efficient computing. Applied hosted the summit in Singapore, where the company has been collaborating on advanced packaging R&D with its customers and partners for over a decade.
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