Nano Dimension Announces New DragonFly IV 3D-Printer and FLIGHT Software Package.
Creates Breakthrough in Additively Manufactured Electronics (AME)
- DragonFly IV enables manufacturing of new classes of High-Performance Electronic Devices (Hi-PEDs®)
- FLIGHT software provides end-to-end, complete design-to-manufacturing process for Additively Manufactured Electronics
Sunrise, Florida, Nov. 08, 2021 (GLOBE NEWSWIRE) -- Nano Dimension Ltd. (“Nano Dimension”, Nasdaq: NNDM), an industry-leader in Additively Manufactured Electronics (AME), Printed Electronics (PE), and Micro Additive Manufacturing (Micro-AM), today introduces its new DragonFly IV printer and FLIGHT software platform.
Nano Dimension is the leading provider of intelligent machines for the fabrication of AME. The new DragonFly IV system, combined with FLIGHT software, delivers new levels of quality, efficiency, and print resolution in the 3D printed electronics sector - providing increased flexibility to design any 3D geometry and create innovative new products.
DragonFly IV is a Dielectric & Conductive-Materials Additive Manufacturing System aimed for fabrication of High-Performance Electronic Devices (Hi-PEDs®) by depositing the proprietary materials simultaneously, while concurrently integrating in-situ capacitors, antennas, coils, transformers, and electro-mechanical components.
J.A.M.E.S GmbH from Munich, Germany, is a joint venture with Hensoldt and a DragonFly IV beta-customer. Its Chief Executive Officer, Andreas Muller, commented: “The DragonFly IV is a milestone within the evolution of AME technology. Nano Dimension’s latest system, combined with the new FLIGHT software, enables the completion of complex jobs like no other AME system before. The J.A.M.E.S electronic design engineers’ community will greatly benefit from better access to AME solutions enabled by the FLIGHT software platform and the first-of-a-kind collaboration of ECAD/MCAD 3D design and testing.”
DragonFly IV 3D-AME Printer
DragonFly IV delivers improved accuracy of traces, spacing, and vias, improved PCB product quality, and the ability to design and produce 3D Hi-PEDs® in a one-step production process.
New capabilities include:
- Integration with Nano Dimension’s new FLIGHT software
- Integration of 3D elements in PCB
- 3D designed Hi-PEDs®
- Support of HDI level elements
- 75µm traces; 100µm spacing; 150µm via
- Enhanced print quality, optimizing yield with predictable conductivity
- Low thickness variation
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