Patent Issued for Method For Aligning Substrate And Apparatus For Cutting Substrate Using The Same (USPTO 10,442,101): Samsung Display Co. Ltd.

Published

Samsung Display Co. Ltd.

2019 OCT 28 (NewsRx) -- By a News Reporter-Staff News Editor at South Korea Daily Report -- Samsung Display Co. Ltd. (Yongin-si, Gyeonggi-do, South Korea) has been issued patent number 10,442,101, according to news reporting originating out of Alexandria, Virginia, by NewsRx editors.

The patent’s inventor is Kim, Ik Kyoung (Asan-si, South Korea).

This patent was filed on July 28, 2016 and was published online on October 28, 2019.

From the background information supplied by the inventors, news correspondents obtained the following quote: “Field of the Invention

“The present invention relates to an apparatus for aligning a substrate and an apparatus for cutting a substrate using the same.

“Description of the Related Art

“According to the trend of lightweight and thin-filming of not only home display devices, such as TVs and monitors, but also portable display devices, such as notebook computers, cellular phones and PMPs, various flat display devices have been widely used. Flat display devices, which have currently been produced or developed, include a liquid crystal display (LCD), an electro luminescent display (LED), a flat emission display (FED), a plasma display panel (PDP), and an organic light emitting display (OLED).”

Supplementing the background information on this patent, NewsRx reporters also obtained the inventor’s summary information for this patent: “A procedure for producing a flat display device includes various kinds of processes which are sequentially performed on a substrate. In order for the respective processes that are sequentially performed so as to be accurately performed on the substrate, it is essential to align the position of the substrate in the respective processes.

“In particular, flat display devices are produced through a process of cutting and separating a mother substrate, which is made of glass, silicon, or ceramic, into unit substrates, and in order to cut the mother substrate accurately and stably, it is necessary that the mother substrate be in a preferable alignment state.

“One subject to be solved by the present invention is to provide an apparatus for aligning a substrate, which can maintain a more accurate and stable alignment state, and an apparatus for cutting a substrate using the same.

“Additional advantages, subjects, and features of the invention will be set forth in part in the description which follows, and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.

“In one aspect of the present invention, there is provided an apparatus for aligning a substrate comprising a stage on which the substrate is seated and reference pins provided to project from an upper surface of the stage, wherein the reference pin has a substrate support surface which supports one side of the substrate, and an upper end of which is formed so as to project further toward the substrate than a lower end thereof.

“In another aspect of the present invention, there is provided an apparatus for cutting a substrate comprising a stage on which the substrate is seated, reference pins which are formed so as to project from one side of the stage to support one side of the substrate and an upper end of which is formed so as to project further toward the substrate than a lower end thereof, and a cutting portion provided on an upper portion of the stage to cut the substrate.

“According to embodiments of the present invention, at least the following advantages can be achieved.

“That is, by the shape of the reference pins, each of which has the upper end that is formed so as to project to the substrate side as compared with the lower end thereof, the substrate can be stably aligned in a state where the reference pins preferentially support the upper end of one side of the substrate. Furthermore, a crack, which may occur on the reference pin due to the repeated use thereof, can be guided to the upper side thereof that supports the upper end of the one side of the substrate, and thus the substrate can be stably aligned, even after the crack occurs.

“The advantages according to the present invention are not limited to the contents as exemplified above, but other various advantages are described in the specification of the present invention.”

The claims supplied by the inventors are:

“What is claimed is:

“1. A method for cutting a substrate, comprising: preparing a stage having a rectangular shape with four edges, the stage having a row of reference pin installation grooves positioned adjacent solely and exclusively to one entire edge of the four edges of the stage and a plurality of suction holes uniformly distributed in rows and columns adjacent to the row of reference pin installation grooves, and reference pins inserted into the row of reference pin installation grooves and partially projecting from an upper surface of the stage; loading a substrate on the stage; pushing the substrate toward the reference pins such that only an upper end of one side of the substrate is supported at one side of each of the reference pins to align the substrate on the stage; forming a vacuum pressure between the stage and the substrate to fix the substrate to the stage; and cutting the fixed substrate by using a cutting portion provided on an upper portion of the stage, wherein said each reference pin includes a projection end which is formed to extend from at least two insertion ends and project from the upper surface of the stage, wherein said each projection end supports one side of the substrate, and an upper end of said each reference pin is formed to project further toward the substrate than a lower end of said each respective projection end, and wherein a longitudinal length of said each projection end is at least a distance between adjacent reference pin installation grooves, and the at least two insertion ends are formed on a lower portion of said each projection end, wherein the at least two insertion ends are inserted into the reference pin installation grooves.

“2. The method for cutting a substrate of claim 1, wherein said each reference pin includes an inversely inclined surface which connects the upper end and the lower end of said each reference pin and which supports the substrate.

“3. The method for cutting a substrate of claim 2, wherein: said each inversely inclined surface includes a support end having an upper support surface and a side support surface intersecting the upper support surface; said each upper support surface has a same height as a height of the substrate, and is configured to surface contact with at least a portion of one upper surface of the substrate; and said each side support surface is configured to surface contact with at least a portion of one side surface of the substrate.

“4. The method for cutting a substrate of claim 1, wherein an acute angle that is formed between the inversely inclined surface and the stage is not less than 85 degrees.

“5. The method for cutting a substrate of claim 1, wherein said each reference pin includes an inversely inclined surface that is formed so as to extend from the upper end of said each reference pin to a lower side of a substrate support surface, and a support end recessively formed from the lower end of the inversely inclined surface to an inside direction of said each reference pin so as to directly contact the substrate.

“6. The method for cutting a substrate of claim 5, wherein said each support end has a step-style structure that projects with a step height toward the substrate as said each support end extends to the upper side of said each substrate support surface.

“7. The method for cutting a substrate of claim 1, wherein said each reference pin includes a first inversely inclined surface that is formed so as to extend from the upper end of said each reference pin to a lower side of a substrate support surface, a second inversely inclined surface that is formed so as to extend from the lower end of said each substrate support surface to an upper side of said each substrate support surface, and a support end formed between said each first inversely inclined surface and said each second inversely inclined surface and recessively formed in an inside direction of said each reference pin so as to support one side of the substrate.

“8. The method for cutting a substrate of claim 7, wherein said each support end has a step-style structure that projects with a step height toward the substrate as said each support end extends to the upper side of said each substrate support surface.

“9. The method for cutting a substrate of claim 1, wherein said each reference pin has a step-style structure that projects with a step height toward the substrate as said each reference pin extends from the lower end of said each reference pin to the upper end of said each reference pin.”

For the URL and additional information on this patent, see: Kim, Ik Kyoung. Method For Aligning Substrate And Apparatus For Cutting Substrate Using The Same. U.S. Patent Number 10,442,101, filed July 28, 2016, and published online on October 28, 2019. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=10,442,101.PN.&OS=PN/10,442,101RS=PN/10,442,101

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