Huawei to issue first onshore yuan bond starting Oct. 22

Credit: REUTERS/HANNIBAL HANSCHKE

The parent company of Huawei Technologies Co Ltd [HWT.UL] will issue a 3 billion yuan ($422.61 million) onshore bond on Oct. 22-23, it said in a filing on Thursday.

SHANGHAI, Oct 17 (Reuters) - The parent company of Huawei Technologies Co Ltd HWT.UL will issue a 3 billion yuan ($422.61 million) onshore bond on Oct. 22-23, it said in a filing on Thursday.

The details on the issue date for the three-year unsecured bond, posted on the website of the Shanghai Clearing House, follows Huawei's announcement in September that it would issue two tranches of bonds worth 3 billion yuan each.

The bond is Huawei's first tapping of the onshore yuan bond market.

($1 = 7.0987 Chinese yuan)

(Reporting by Andrew Galbraith; editing by Darren Schuettler)

((Andrew.Galbraith@tr.com; +86 21 2083 0079; Reuters Messaging: andrew.galbraith.thomsonreuters.com@reuters.net ; Twitter: https://twitter.com/apgalbraith))

The views and opinions expressed herein are the views and opinions of the author and do not necessarily reflect those of Nasdaq, Inc.

Reuters

Reuters, the news and media division of Thomson Reuters, is the world’s largest international multimedia news provider reaching more than one billion people every day. Reuters provides trusted business, financial, national, and international news to professionals via Thomson Reuters desktops, the world's media organizations, and directly to consumers at Reuters.com and via Reuters TV.

Learn More