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Company Description (as filed with the SEC)
We design, manufacture, market and globally support semiconductor wafer processing equipment used in the fabrication of integrated circuits ("ICs" or chips). We are a key supplier of dry strip, rapid thermal processing ("RTP"), and etch equipment to the global semiconductor industry. Our manufacturing equipment utilizes innovative technologies to deliver advanced processing capabilities and high productivity for the fabrication of current and next-generation ICs. In 2013, we expanded our market positions for both of our RTP products in the foundry and logic segment. Our RTP product portfolio, including the Helios XP for conventional RTP and the Millios for millisecond anneal ("MSA"), have demonstrated significant device performance improvements at various foundry and logic customers. Our RTP products' superior low temperature capability, combined with our technology to address thermal related non-uniformities at the device level, continues to grow our RTP business. ... More ...