Cadence Design Systems, Inc. Press Releases

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3D IC Expands in New Dimensions at Si2
8/13/2014 8:55:00 AM - Business Wire

Si2 Names New Director of System-Level, Low Power Design
8/12/2014 8:56:00 AM - Business Wire

Cadence Introduces Voltus-Fi Custom Power Integrity Solution, Delivering Foundry-Certified SPICE-Level Accuracy for Transistor-Level Power Signoff
8/4/2014 8:00:00 PM - PR Newswire

Cadence Senior Vice President and Chief Financial Officer Geoff Ribar to Present at the Pacific Crest Global Technology Leadership Forum
7/31/2014 12:45:00 PM - PR Newswire

Airoha Technology Adopts Cadence RTL Synthesis and Test Solution, Reducing Power Consumption by 15 Percent
7/30/2014 10:45:00 AM - PR Newswire

Cadence Achieves PCIe 3.0 Compliance for PHY and Controller IP
7/29/2014 10:45:00 AM - PR Newswire

MEDIA ALERT: Cadence to Deliver Keynote Speech and Showcase IP Technology at 2014 Flash Memory Summit
7/28/2014 10:45:00 AM - PR Newswire

Renesas Achieves 3X Reduction in Chip-Finishing Turnaround Time Using Cadence QuickView Signoff Data Analysis Environment
7/24/2014 10:45:00 AM - PR Newswire

Cadence Introduces Three New OrCAD PCB Products Targeting Emerging Electronic Product Design Challenges
7/23/2014 10:45:00 AM - PR Newswire

Cadence Reports Second Quarter 2014 Financial Results
7/21/2014 4:05:00 PM - PR Newswire

Cadence Announces Protium Rapid Prototyping Platform and Expands System Development Suite Low-Power Verification
7/17/2014 10:45:00 AM - PR Newswire

Ricoh Cuts Parasitic Extraction Design Closure Time in Half Using Cadence Quantus QRC Extraction Solution
7/15/2014 11:14:00 AM - PR Newswire

Cadence Quantus QRC Extraction Solution Certified for TSMC 16nm FinFET
7/14/2014 8:00:00 PM - PR Newswire

Cadence Announces Next-Generation Quantus QRC Extraction Solution, Delivering Best-in-Class Performance and Accuracy
7/14/2014 8:00:00 PM - PR Newswire

Hitachi Tapes Out 28nm Design with Cadence Tempus Timing Signoff Solution, Reducing Timing Closure by One Month
7/7/2014 10:45:00 AM - PR Newswire

Cadence Announces Second Quarter 2014 Financial Results Webcast
7/7/2014 8:00:00 AM - PR Newswire

MegaChips Adopts Cadence RTL-to-Signoff Solution, Cuts Tapeout Schedule in Half
6/30/2014 10:45:00 AM - PR Newswire

LTE Protocol Stack from NextG-Com Now Available on Cadence Tensilica Processor
6/24/2014 10:45:00 AM - PR Newswire

Cadence and QNX Announce New Tensilica HiFi Audio/Voice DSP Application for In-Car Active Noise Control
6/23/2014 10:45:00 AM - PR Newswire

Media Alert: Chris Rowen to Present at Beyond Fusion Conference
6/20/2014 12:00:00 PM - PR Newswire

Application Software Equities under the Scanner -- Research on Cadence Design Systems, TiVo, Jive Software, and Compuware
6/18/2014 7:40:00 AM - PR Newswire

Cadence Completes Acquisition of Jasper Design Automation
6/16/2014 8:45:00 AM - PR Newswire

Cadence and Intel Collaborate to Enable a 14nm Tri-gate design Platform for Customers of Intel Custom Foundry
6/3/2014 9:00:00 AM - Business Wire