CDNS

Cadence Design Systems, Inc. Press Releases

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Exchange: NASDAQ
Industry: Technology
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Renesas Achieves 3X Reduction in Chip-Finishing Turnaround Time Using Cadence QuickView Signoff Data Analysis Environment
7/24/2014 10:45:00 AM - PR Newswire

Cadence Introduces Three New OrCAD PCB Products Targeting Emerging Electronic Product Design Challenges
7/23/2014 10:45:00 AM - PR Newswire

Cadence Reports Second Quarter 2014 Financial Results
7/21/2014 4:05:00 PM - PR Newswire

Cadence Announces Protium Rapid Prototyping Platform and Expands System Development Suite Low-Power Verification
7/17/2014 10:45:00 AM - PR Newswire

Ricoh Cuts Parasitic Extraction Design Closure Time in Half Using Cadence Quantus QRC Extraction Solution
7/15/2014 11:14:00 AM - PR Newswire

Cadence Quantus QRC Extraction Solution Certified for TSMC 16nm FinFET
7/14/2014 8:00:00 PM - PR Newswire

Cadence Announces Next-Generation Quantus QRC Extraction Solution, Delivering Best-in-Class Performance and Accuracy
7/14/2014 8:00:00 PM - PR Newswire

Hitachi Tapes Out 28nm Design with Cadence Tempus Timing Signoff Solution, Reducing Timing Closure by One Month
7/7/2014 10:45:00 AM - PR Newswire

Cadence Announces Second Quarter 2014 Financial Results Webcast
7/7/2014 8:00:00 AM - PR Newswire

MegaChips Adopts Cadence RTL-to-Signoff Solution, Cuts Tapeout Schedule in Half
6/30/2014 10:45:00 AM - PR Newswire

LTE Protocol Stack from NextG-Com Now Available on Cadence Tensilica Processor
6/24/2014 10:45:00 AM - PR Newswire

Cadence and QNX Announce New Tensilica HiFi Audio/Voice DSP Application for In-Car Active Noise Control
6/23/2014 10:45:00 AM - PR Newswire

Media Alert: Chris Rowen to Present at Beyond Fusion Conference
6/20/2014 12:00:00 PM - PR Newswire

Application Software Equities under the Scanner -- Research on Cadence Design Systems, TiVo, Jive Software, and Compuware
6/18/2014 7:40:00 AM - PR Newswire

Cadence Completes Acquisition of Jasper Design Automation
6/16/2014 8:45:00 AM - PR Newswire

Cadence and Intel Collaborate to Enable a 14nm Tri-gate design Platform for Customers of Intel Custom Foundry
6/3/2014 9:00:00 AM - Business Wire

Si2’s Low Power Coalition Releases Initial Specification Supporting Multi-Level Power Modeling
6/2/2014 1:23:00 PM - Business Wire

Cadence Virtuoso Layout Suite for Electrically Aware Design Adopted By ON Semiconductor
6/2/2014 10:45:00 AM - PR Newswire

MEDIA ALERT: Cadence Showcases the Latest Innovations at DAC 2014
5/29/2014 10:45:00 AM - PR Newswire

ChipEstimate.com Media Alert: Meet Leading IP Suppliers and Foundries At DAC 2014 During ChipEstimate.com IP Talks
5/27/2014 10:45:00 AM - PR Newswire

Media Alert: Cadence to Showcase Comprehensive PCI Express IP and Verification Solutions at PCI-SIG 2014
5/27/2014 10:45:00 AM - PR Newswire

Cadence Offers Production Proven USB 3.0 Host Controller IP
5/27/2014 10:45:00 AM - PR Newswire

Si2 Announces Release of OpenAccess Scripting Interface v3.0
5/27/2014 7:00:00 AM - Business Wire

Si2 Announces New Thermal Interface Protocol Standard for 3D Integrated Circuits
5/23/2014 7:37:00 AM - Business Wire

Media Alert: Chris Rowen to Present at Embedded Vision Summit West 2014
5/21/2014 1:00:00 PM - PR Newswire