Legacy of plastic packaging innovation for wireless infrastructure
equipment continues with an industry first for harsh industrial
TAMPA BAY, Fla.--(BUSINESS WIRE)--
Continuing its long track record of RF power technology leadership,
Freescale Semiconductor (NYSE:FSL) introduces its first plastic
packaged devices designed specifically for high ruggedness applications.
The new MRFE6VP5150N/GN and MRFE6VP5300N/GN power amplifiers are the
industry's first > 65:1 VSWR rated devices to be housed in over molded
"Freescale has deployed millions of RF power transistors in plastic
packages for macrocell base stations in the cellular market," said Paul
Hart, senior vice president and general manager for Freescale's RF
business. "We are now extending our RF power amplifier packaging
expertise to industrial applications. The new MRFE6VP5150 and
MRFE6VP5300 devices are the first members of a plastic package product
portfolio engineered for optimal ruggedness, and are an expansion of our
highly successful MRFE6VP61K25 family."
Compared to ceramic RF packages, plastic packaging features superior
manufacturability, outstanding thermal impedance and significant cost
benefits. By combining the advantages of plastic packaging with the
ruggedness traditionally associated with ceramic-housed devices,
Freescale has achieved a significant technology milestone for the
benefit of its RF power customer base.
Industrial environments are notoriously harsh. Devices are required to
not only survive, but perform optimally under varying voltages and
operating conditions. With a survivability rating of > 65:1 VSWR with
simultaneous over voltage and overdrive, Freescale's new MRFE6VP5150 and
MRFE6VP5300 devices are designed to thrive in these environments while
delivering outstanding system reliability and low maintenance costs.
Target applications for the new products include FM broadcast, CO2
lasers for medical applications, and VHF and UHF base stations for
public safety radio installations.
In addition to their industry leading ruggedness, Freescale's new
MRFE6VP5150 and MRFE6VP5300 devices facilitate high gain across a wide
frequency range, requiring fewer parts and reducing design complexity.
The devices' high energy efficiency simplifies cooling, thus lowering
operating expenses and shrinking form factors.
These new RF power LDMOS transistors support wide frequency range
utilization - from 1.8 and 600 MHz. The MRFE6VP5150 device is capable of
handling a load mismatch of > 65:1 VSWR at 50 Vdc, 230 MHz at multiple
phase angles; and is capable of 150 Watts CW operation. In addition,
both devices incorporate integrated stability enhancements and
integrated ESD protection circuitry.
Demonstration at IMS 2014
Freescale will demonstrate the MRFE6VP5150 and MRFE6VP5300 devices in
booth 1315 at the International Microwave Symposium (IMS) in Tampa Bay,
Florida on June 3-5, 2014. For more information, please visit www.ims2014.org.
Availability and Support
The MRFE6VP5300 is sampling now and available in production quantities.
Samples of the MRFE6VP5150 are also available, and production quantities
are expected in Q3 2014. A broad array of support tools, including
broadband fixtures available for reference, global and regional
applications support, and requisite model tools are additionally
available. For more information please contact Freescale Sales or visit www.freescale.com/RFpower.
this: .@Freescale expands RF portfolio with industry's highest
ruggedness rating in plastic packaged high powered devices
About Freescale Semiconductor
Freescale Semiconductor (NYSE:FSL) is a global leader in embedded
processing solutions, providing industry-leading products that are
advancing the automotive, consumer, industrial and networking markets.
From microprocessors and microcontrollers to sensors, analog integrated
circuits and connectivity - our technologies are the foundation for the
innovations that make our world greener, safer, healthier and more
connected. Some of our key applications and end-markets include
automotive safety, hybrid and all-electric vehicles, next generation
wireless infrastructure, smart energy management, portable medical
devices, consumer appliances and smart mobile devices. The company is
based in Austin, Texas, and has design, research and development,
manufacturing and sales operations around the world. www.freescale.com
Freescale and the Freescale logo are trademarks of Freescale
Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or
service names are the property of their respective owners. ©
2014 Freescale Semiconductor, Inc.
Source: Freescale Semiconductor