By Business Wire, March 11, 2013, 08:00:00 AM EDT
Achievement underscores continued technology leadership for industry's
No. 1 provider of advanced RF power products
AUSTIN, Texas--(BUSINESS WIRE)--
Freescale Semiconductor (NYSE:FSL), the worldwide leader in high-power
radio frequency (RF) power transistors, recently reached a milestone
unparalleled in the industry - shipment of more than 175 million
high-power, high-frequency RF power transistors in plastic packages.
Freescale's RF power over-molded plastic packaging provides
cost-effective and reliable alternatives to conventional, more expensive
metal-ceramic packaging. Freescale's plastic packaging withstands and
dissipates the high heat levels generated by RF power transistors while
maintaining optimal performance levels. This packaging technology is
often far less expensive on a per-unit basis than comparable devices in
air-cavity packages, and over-molded plastic devices simplify customer's
manufacturing processes by enabling a more efficient automated assembly.
"Freescale not only pioneered the development of high-power RF packaging
to meet the demanding requirements of power amplifier manufacturers, but
we continue to set the pace in plastic package performance, temperature
ratings, reliability and volume production," said Ritu Favre, senior
vice president and general manager for Freescale's RF business.
"Shipping more than 175 million RF power devices in plastic packages
underscores the broad market acceptance of Freescale's innovative
plastic packaging technology."
Freescale's heritage of plastic packaging leadership spans more than 30
years. In the mid-1980s the company pioneered low-frequency, high-power
plastic packaging for the automotive and industrial industries. In 1997,
Freescale delivered the industry's first high-power, high-frequency RF
devices in plastic packages optimized for wireless infrastructure
applications. Nine years later, Freescale introduced the first 2 GHz RF
power plastic devices with a maximum junction temperature rating of 225
degrees Celsius, which for the first time matched the frequency, thermal
performance, maximum junction temperature, standards compliance and
reliability of traditional RF transistors in metal-ceramic packages. And
in 2009, Freescale further extended its technology leadership in plastic
packaging with the introduction of OMNI over-molded plastic packaging
engineered for applications in which extreme power, performance and
temperature requirements are common.
Freescale offers the industry's broadest portfolio of RF power devices
in plastic packages, with 12 outlines from which to choose. The current
portfolio covers two- and three-stage driver ICs, as well as two-stage
and discrete finals. The output power of the devices rangesfrom
20 dBm to as high as 300 watts and frequencies from 10 MHz to 2.7 GHz.
In addition, Freescale continues to make the necessary investments in
research and development to meet the rapidly evolving and challenging
requirements of RF industries.
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About Freescale
Freescale Semiconductor (NYSE:FSL) is a global leader in embedded
processing solutions, providing industry leading products that are
advancing the automotive, consumer, industrial and networking markets.
From microprocessors and microcontrollers to sensors, analog integrated
circuits and connectivity - our technologies are the foundation for the
innovations that make our world greener, safer, healthier and more
connected. Some of our key applications and end-markets include
automotive safety, hybrid and all-electric vehicles, next generation
wireless infrastructure, smart energy management, portable medical
devices, consumer appliances and smart mobile devices. The company is
based in Austin, Texas, and has design, research and development,
manufacturing and sales operations around the world. www.freescale.com
Freescale, and the Freescale logo are trademarks of Freescale
Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or
service names are the property of their respective owners. © 2013
Freescale Semiconductor, Inc.
Source: Freescale Semiconductor